Production Volume PCB Fabrication
Production PCB Fabrication
Multi-site, highly reliable, global solution to customers requiring speed to market.
- Small volume to high volume
- Commercial to Military
- Standard to Advanced Technology
- Global ERP/MRP System
- FAE and DFM engineering support
- Seamless Transition to Volume Production
- Production Support in North America and Asia.
Technology includes :
- Single-side to Multi-Layer (1 - 44 Layers)
- High performance materials, including Rogers, Getek, Nelco and Megtron
- High-Density interconnect capabilities including Blind & buried vias, and Via-in-Pad (copper filled and epoxy filled microvias)
- RF and Microwave products
- High aspect ratio plating
- RoHS compliant solutions
- Lead-Free Assembly compatible
- Thermal Management Solutions including coin attach, aluminum or copper heatsink and heavy copper
- HDI using Laser Microvias
- Controlled and Differential Impedance
- Buried Capacitance, Buried Resistance
- Complex Backplanes
- Certifications include : ISO 9001, QS-9000, MIL-55110, MIL-31032, ISO-14001, TS16949, ISO 14001, AS-9100, NADCAP, and ITAR registered.
