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 Fidus Systems Inc. |
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- Electronic Design Services
- Full turnkey from concept to finished product
- Electronic Circuit Design
- System Design
- FPGA
- Capture and PCB Layout Services
- High Speed Signal Integrity
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ADIVA Corporation |
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- Software toolset for PCB design validation utilizing
"virtual manufacturing" technology
- ADIVA software is an easy to use menu driven system that integrates with your CAD system allowing the ADIVA tools to be accessed directly from the menu bar of your CAD software. ADIVA supports a wide variety of platforms including Sun Solaris, HP UX, IBM AIX, Windows NT/2000/XP.
- Customers include a family of leading edge companies such as Sun Microsystems, Agilent, Motorola, Lockheed Martin, Compaq, Juniper Networks, BAE Systems.
- ADIVA consits of the following tools:
- ADIVAsi - Signal Integrity: performance and impedance, propagation delay
- ADIVAdfa - Design For Assembly: virtual assembly concurrent design
- ADIVAnet - Net list tool comparison of design data vs. manufacturing data
- ADIVAdfm - Design For Manufacturing (DFM) tools to verify production
- ADIVAview - Intelligent Viewer: allows the viewing of design data and analysis of the circuits, stackup and design, to ensure that the final design meets the goals and requirements of the designer
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Milplex Circuits (Canada) Inc. |
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- Local PCB Manufacturing with strong overseas partners (Toronto, Korea, China)
- Prototypes to Production ( 2 to 6 Layers)
- 3 Day Prototype Orders, 10 Day Production Orders (Standard)
- Advanced Lab and Testing capabilities including Micro-Section, CMA X-Ray, CMM and SIR
- ISO 9001, ISO 14001 Compliant
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Merix Corporation |
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- Global PCB Manufacturing (USA, Hong Kong, and China)
- Multi Layers (6 to 44 Layers)
- Prototypes in 24, 48, and 72 hours +
- Preproduction and Production in low to large volumes domestically
- Production in medium to large volumes overseas
- High performance materials (IS, Nelco, Megtron, Getek, Rogers, etc.)
- Large format networking cards
- RF Microwave and Digital Technology
- Thermal Management Solutions
- HDI using Laser Microvias
- Controlled and Differential Impedance
- Blind & Buried Vias, Backplane, Via-Fill
- Buried Capacitance & Buried Resistor Technology
- ISO 9001, QS-9000, MIL-31032 and Bellcore certification
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Lenthor Engineering |
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- Low To Medium Volume Flex & Rigid-Flex Circuit Manufacturing and Component Assembly
- Flex & Rigid-Flex circuit design, fabrication and assembly
- HDI, Polyimide and Adhesiveless materials, conductive filled vias, impedance control
- ISO 9001, MIL-P 50884D, IPC 6013 Class 3
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GUL Technologies |
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- Regal and Rigid-Flex Circuit Manufacturing (Singapore based with China facilities)
- Medium to High-Volume Production
- ISO 9001, ISO 14001, and TS16949 Certification
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